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会议回顾

 

ICEPT from 1994…

1994, Beijing: the 1th International Symposium on Microelectronic Package & PCD Technology

1996, Shanghai: the 2nd International Symposium on Electronic Packaging Technology

1998, Beijing: the 3rd ISEPT

2001, Beijing: the 4th ISEPT

2003, Shanghai: the 5th International Conference on Electronic Packaging Technology

2005, Shenzhen: the 6th ICEPT

 

2006, Shanghai: the 7th ICEPT

 

2007, Shanghai: the 8th ICEPT

 

2008, Shanghai: the 9th ICEPT-HDP (High Density Packaging)

 

2009, Beijing: the 10th ICEPT-HDP (High Density Packaging)

 

2010, Xi’an: the 11th ICEPT-HDP (High Density Packaging)

 

4-DAY EVENT:August 16 to 19, 2010, Xi'an, China
 
Are you contributing to the development in the following themes?
FEATURE:short courses, keynotes, technical sessions, and posters!

.Advanced Packaging & System Integration

.Packaging Materials & Processes

.Packaging Design and Modeling

.High Density Substrate & SMT

.Packaging Equipment & Advanced Manufacturing Technologies

.Quality & Reliability

.Emerging Technologies
 

You are being INVITED!

  

  

Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics （CIE-EMPT）
Beijing Office: Room 411,27 Zhichun Road,Haidian Dist.,Beijing,China 100191
Tel:+86-10-82356605 Fax:+86-10-82356605 E-mail:empt-cie@sohu.com
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