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会议回顾

ICEPT from 1994…

1994, Beijing: the 1th International Symposium on Microelectronic Package & PCD Technology

1996, Shanghai: the 2nd International Symposium on Electronic Packaging Technology

1998, Beijing: the 3rd ISEPT

2001, Beijing: the 4th ISEPT

2003, Shanghai: the 5th International Conference on Electronic Packaging Technology

2005, Shenzhen: the 6th ICEPT

2006, Shanghai: the 7th ICEPT

2007, Shanghai: the 8th ICEPT

2008, Shanghai: the 9th ICEPT-HDP (High Density Packaging)

2009, Beijing: the 10th ICEPT-HDP (High Density Packaging)

2010, Xi’an: the 11th ICEPT-HDP (High Density Packaging)

Electronic Manufacturing and Packaging Technology Society of Chinese Institute of Electronics(CIE-EMPT)
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