PacTech – Packaging Technologies, is a leading provider of laser assisted bonding, laser assisted reflow and solder balling/jetting equipment as well as wet chemical plating lines. The company also offers plating chemistries and high-volume subcontractor bumping and die preparation services for semiconductors, catering to diverse applications in consumer electronics, automotive, aerospace, sensors, MEMS, RF, and AI technologies. With manufacturing facilities in Germany (HQ), the USA, and Malaysia, PacTech is well-positioned to support the evolving needs of the semiconductor industry worldwide.

PacTech – Packaging Technologies，是一家激光辅助键合、激光辅助回流、网板植球/激光植球以及湿法晶圆级化学镀设备的领先供应商。本公司还提供晶圆级化学镀化学品，以及晶圆级封装代工服务（包含凸点制备、芯片级封装等）。可覆盖消费电子、汽车、航空航天、传感器、MEMS、射频及人工智能技术等多种应用场景。PacTech在德国（总部）、美国和马来西亚有生产基地，可满足全球半导体行业不断变化的需求。