《Q-band 4×4 Phased-Array Antenna-in-Package (AiP) for High-Efficiency mmWave  NTN Applications》

   Dr. Li-Cheng Shen

   AVP, Universal Global Scientific Industrial Co., Ltd.，Taiwan, China

演讲摘要：

With the emergence of 6G and non-terrestrial networks (NTN), such as high-altitude platform systems (HAPS), electronically steered arrays (ESA) modules to achieve high efficiency, linearity, and thermal reliability across wide millimeter-wave bands are getting more and more attentions. These applications demand compact and thermally robust integration technologies applicable to airborne or space environments. With increasing complexity, large phased-arrays face trade-offs among development time, cost, and reliability. Under these constraints, modularization emerges as a key enabler for mmWave phased-array AiP development, allowing scalable assembly, rapid prototyping, and efficient system-level verification. In this talk, a Q-band 4×4 circularly polarized phased-array module integrating Cu pillar pins and M7-level SLP achieving 44 dBm EIRP and scalable manufacturability will be presented.

演讲人简介：

Dr. Li-Cheng Shen is currently the AVP of Miniaturization Competence Center of USI, focusing on developing and researching cutting-edge technologies of miniaturization. With more than 25 years of experience in the semiconductor industry, Dr. Shen owned more than 30 patents in the fields of Fault Diagnosis System, 3D Package, Wafer Level Package, Opto-electronic Package, Electro-optical Circuit Board, Embedded Component Substrates, RF Module Testing and RF SiP/System Assembly. He is also the technical committee member of ED&A (Electrical Design and Analysis) of ECTC. In 1998, Dr. Shen received his PH.D. degree in Electrical and Control Engineering from National Yang-Ming Chiao-Tung University, Taiwan.