ICEPT Outstanding Paper Award

Multi-chip Stacking with Fine Pitch μbumps and TSVs for Heterogeneous Integration

Yangyang Yan, Guojun Wang, Hanqiang Su, Peng Sun, Fengwei Dai and Liqiang Cao

The National Center for Advanced Packaging (NCAP China)

Simulation and Thermal Fatigue Analysis for Board Level BGA Connection of HTCC Packaging

Yangyang Li, Hui Wang, Yang Li, Dong Dong, Yaning Zhang and Yinquan Lu

Southwest China Research Institute of Electronic Equipment

Fabrication of Fine Patterned Structure for High-density Fan-out Wafer Level Package Using Dry Etching Technology

Daisuke Hironiwa, Chao Zuo, Yao-Chih Hsieh, Taichi Suzuki, Yasuhiro Morikawa and Ryuichiro Kamimura

Advanced Electronics Equipment Division Product Development Department, ULVAC Inc.

Study on Light Emitting Surface Temperature of LEDs

Fanny Zhao, Guoshuai Dong, Guoming Yang, Yapei Zeng, Brian Shieh and S. W. Richy Lee

HKUST LED-FPD Tech. R&D Center

A Comprehensive Failure Analysis and a Study on Reliability for BGA Solder Joints Crack of DDR Modules

Jingrui Chai, Xiping Jiang, Xudong Gao, Zhengwen Wang, Peng Yin, Qian Wang and Gang Dong

Department of Quality and Reliability, Xi’an UniIC Semiconductors Co., Ltd.

Warpage Simulation and Prediction For BGA Package With Different BOM and Structure

Feng Wang, Na Mei, Tingting Song and Tuobei Sun

Department of Packaging and Testing, ZTE Corporation

Molecular Dynamics Simulation of Melting and Sintering Process of Multi-scale Copper Nanoparticles

Bin Yang, Yu Zhang, Chao Li, Xiangang Hua, Chuman Ho, Guannan Yang, Tingyu Lin and Chengqiang Cui

Guangdong Fozhixin Microelectronics Technology Research Co., Ltd

Versatile TIM Solution with Chain Network Solder Composite

Runsheng Ma, Sihai Chen, Elaina Zito, David Bedner and Ning-cheng Lee

Indium Corporation

Study on Influencing Factors of Gold Wire Bonding Performance of Nickel-free Soft Gold Microwave PCB

Bo Zhou, Xiao He, Yabing Zou, Xingxing Li and Guanghui He

Reliability Research and Analysis Center (RAC), China Electronic Product Reliability and Environmental Testing Research Institute (CEPREI)

A novel integrated structure of GaN embedded module

Jun Li, Jing Jiang, Yan Sheng, Hua Miao and Huaiyu Ye

Shenman Circuits Company Limited

ICEPT Outstanding Poster Award

Effect of Power on the Hollow Phenomenon during Laser Sintering of Copper Nanoparticles

Shaogen Luo, Guannan Yang, Guangdong Xu, Chengqiang Cui and Yu Zhang

Key Laboratory of Precision Microelectronic Manufacturing Technology & Equipment of Ministry of Education, Guangdong University of Technology

Advanced Packaging of 3D Fan-out RF Microsystem for 5G IoT Communication

Chenhui Xia, Hui Wang, Gang Wang and Xuefei Ming

Micro System Manufacturing Department, CETC 58

Process development of Large Size Embedded Silicon Fan-out (eSiFO) Package

Xiaomin Gu, Shuying Ma, Jiao Wang and Yongde Hao

School of Optical and Electronic Information, Huazhong University of Science and Technology

Micro-rectangular Coaxial Structure-based Broadband Millimeter-wave Power Divider

Le Dong, Yingfei Lv, Hui Xiao, Jun Lu, Yaopei Jiang and Yang Li

The 29th Research Institute of China Electronics Technology Group Corporation

ICEPT Best Student Paper Award

Development of 3D Wafer Level Package for SAW Filters Using Thin Film Lamination

Zuohuan Chen, Mingchuan Zhang, Kai Zhu, Feng Jiang and Dayuan Yu

School of Electronic Science and Engineering, Xiamen University

Research on Optical interconnect transmitter based on Mach-Zehnder silicon optical chip

Qi Zhang, Huimin He, Fengman Liu, Juan Wei, Yu Sun, Haiyun Xue, Siwei Sun and Liqiang Cao

Microsystem Packaging Research Center, Institute of Microelectronics of Chinese Academy of Sciences

Research on the Anisotropic Mechanical Behavior of Microscale Sn58Bi Solder Matrix via Finite Element Simulation

Wei Qin, Tian-feng Kuang, Chao Ding, Chu-yi, Lei, Wang-yun, Li and Hong-bo Qin

School of Mechanical and Electronic Engineering Guilin University of Electronic Technology

A Cu-Sn/BCB Hybrid Bonding with Embedded Bump Structure

Xiuyu Shi, Jun Wang, Qian Wang, Hongwen He, Simin Wang, Heng Li, Menglong Sun and Jian Cai

Department of Microelectronics and Nanoelectronics, Tsinghua University

Analysis of Heat Dissipation Characteristics of Three-dimensional Graphene-carbon Nanotube Composite Structures

Hang Yin, Yan Zhang, Pei Lu, Yong Zhang, Johan Liu

SMIT Center, School of Mechatronics Engineering and Automation, Shanghai University

Highly strength Cu-Cu joint formation by sintering of copper nanomaterials

Tao Lai, Yu Zhang, Guannan Yang, Chengqiang Cui, Ping Cao, Jiewu Leng

State Key Laboratory of Precision Electronic Manufacturing Technology and Equipment Guangdong University of Technology

Grafting of a Porous Polymethyl Methacrylate (PMMA) Film on the Silicon Surface with Low Dielectric Constant

Ziyan Wen, Yang Liu, Yunwen Wu, Tao Hang and Ming Li

Lab of Microelectronic Materials & Technology, State Key Laboratory of Metal Matrix Composites, School of Materials Science and Engineering, Shanghai Jiao Tong University

Flexible Film Heater Fabricated by Optimized PEDOT:PSS-GO/AgNW Composite Transparent Conductive Film with Enhanced Water Resistance

Kaiqing Wang, Xiaocun Wang, Jianzhang Wang and Fei Xiao

Department of Materials Science, Fudan University

Shear Viscosity of Polydimethylsiloxane Melt by Molecular Dynamics Simulation

Chaoyue Ji, Chenyang Wang, Xintian Cai and Sheng liu

The Institute of Technological Sciences Wuhan University

Simulation Based Design of Deep Ultraviolet LED Array Module Used in Virus Disinfection

Yixing Cao, Wei Chen, Min Li, Bin Xu, Jiajie Fan, Guoqi Zhang

Academy for Engineering & Technology, Fudan University

Dead-time Optimization for Double-Clamped Zero Voltage Switching Buck-Boost Power Converter with Primary Side Sampled Feedback Control

Song Ding, Qinsong Qian, Cheng Gu, Shengyou Xu and Qi Liu

Nation ASIC System Engineering & Research Center, Southeast University

Stretchable and Printable Conductive Polymer Composites for Electromagnetic Interference (EMI) Shielding Meshes

Xuebin Liu, Zuomin Lei, Zhiqiang Lin, Yougen Hu, Pengli Zhu and Rong Sun

Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institutes of Advanced Technology, Chinese Academy of Sciences