第二十二届电子封装技术国际会议
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厦门大学(电子科学与技术学院承办)
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PDC-1: The Status and Prospect of Ag and Cu Sintering Paste Bonding Technology
PDC-2: Failure Analysis in Semiconductor Packaging Assembly Process
PDC-3: Progress of Advanced 3D Wafer Level Packaging: 2.5 Interposer, 3D IC and High- Density Fan-Out Technology
PDC-4: Co-Design and Manufacturing – Nano Electronic Packaging and Optoelectronic Packaging
PDC-5: Design of the 3rd Generation Semiconductor-Based Power Electronics Solutions for Smart City Applications
PDC-6: Emerging Power Packaging Technology and Process
SIAT Session: Advanced Electronic Packaging Materials Research and Application